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Artificial electromagnetic materials are material materials that control light in an unusual way at nanoscale. They can be used to develop foreign equipment such as invisible cloaks to quantum computers. But the problem is that the metamaterials they use usually contain metals that absorb energy from light and convert it into heat. As a result, a portion of the optical signal is wasted, reducing the efficiency of the device. A photonics 500mw laser pointer research team led by Shaya Fainman, an electrical engineering professor at the University of California, San Diego, demonstrated the use of metallic materials that add excitation light to compensate for these optical losses, an optical semiconductor.

Laser cutting has the same advantages as conventional processing methods. In the thermal cutting method, oxygen-combustible (such as acetylene) cutting and plasma cutting can not concentrate as much energy as a laser beam in a very small area, resulting in large incision width, large heat affected area and more obvious deformation of the workpiece. Oxygen- combustible cutting equipment is small, less investment, can cut up to 1m thick steel plate, is a very flexible cutting tools, mainly used to cut low carbon steel. However, due to its large heat affected area, cutting speed is low, the incision appears serious jagged and corrugated. Therefore, it is rarely used to cut the thickness of 20mm or less and require accurate size of the material. Plasma cutting is similar to 400mw laser pointer cutting speed, significantly higher than acetylene flame cutting. But its cutting energy is low, trimming at the top of a round head, cut from the obvious waveform.

In operation, but also to prevent the arc generated by the UV radiation on the operator of the damage. Conventional fiber lasers use fiber-coupled technology to couple multiple laser outputs together, resulting in lower brightness of the output laser. The new generation of fiber lasers uses an innovative architecture that combines the pump diodes and drivers into separate pump modules. The gain fiber is mounted in a configurable gain module that can output more than 8kW of laser power. The gain module is based on the novel main oscillator / power amplifier (MOPA) design, enabling high-brightness 300mw laser pointer output. In addition, the Ennie laser also uses a reliable integrated backlash isolator to protect all modules from the impact of backlit light, can be high anti-material for full power, uninterrupted, stable processing. These two technological innovations play a vital role in RLS applications.

For iron and steel enterprises, the establishment of laser processing sheet metal distribution center, has a unique advantage. First, the production of sheet metal production and sales base, over the years to establish a wide range of sales channels, customer relations and sales network, the production and sales base of the plate, ; The small batch, multi -species needs of users, can directly provide the finished product after 10mw laser pointer precision processing to extend the service chain of the product, resulting in a secondary benefit; cutting waste can be quickly recycled; at the same time, reduce the intermediate transport links, Cost savings, to maximize the profits. And behind all this, laborers can provide long-term, strong technical support.

This is the first time with metal and semiconductor coexistence of a material. If light is one of the ways of polarization, the metamorphic light will be like metal, and when light is polarized in other ways, the metamaterial absorbs and emits light in different colors, like semiconductors, "says Smalley. The new metamaterials, first grown into a crystalline semiconductor material, are called indium gallium arsenide, are on the substrate. Then they use plasma blue laser pointer high-energy ion etching to narrow the grooves to achieve the semiconductors, create 40 nanometers wide and the line spacing of 40 nanometers.Finally, they use silver to create an alternate striped pattern and a silver nanocrystalline trench.

Laser cutting is a kind of high energy density controllable non-contact processing. It focuses the burning laser beam into a spot with a minimum diameter of less than 0.1mm, so that the power density at the focal point can exceed 107W to 108W / cm ~ 2. The irradiated material is quickly heated to the vaporization temperature and evaporated to form pores. As the beam moves relatively linearly with the material, the apertures are continuously formed with slits of about 0.1 mm in width. The cutting also adds auxiliary gas to the material to be cut to accelerate the melting of the material, blown away the slag or protecting the slits from being oxidized.